Acquired ISO9001at Tokyo Factory
Dicing Tape Mount(Semi-Auto Type)
MW-300S
 |
| This machine is to laminate dicing tape to silicon
wafer. |
 |
| Enable to 8/12 inch wafer with semi-auto. Providing wafer and taking out frame mount are by manual. |
Specifications
Max. work piece size
200��300mm
Tact
50sec/1 cycle
Pressure method
Air cylinder
Cut method
Round blade
Device dimensions
��W��880�ߡ�D��720�ߡ�H��650mm
Air supply
Dry air 0.5Mpa
Power supply
AC100V
Weight
120kg
Dicing Tape Mount(Manual type)
MW-200/150
|
| To laminate dicing tape to Si wafer |
|
| Compact manual type for 6/8 inch wafer. Providing wafer flame, cutting tape, taking out of flame mount and laminating. |
Specifications
Max. work piece size
150��200mm
Film width
270mm
Table temperature
Room temperature��60��
Cut method
Round blade by manual
Device dimensions
��W��430�ߡ�D��830�ߡ�H��250mm
Air supply
Dry air 0.5Mpa
Power supply
AC100V 1A
Weight
20kg
|
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