Dicing Tape Mount(Semi-Auto Type)

MW-300S
Dicing Tape Mount(Semi-Auto Type)、MW-300S

Purpose
This machine is to laminate dicing tape to silicon wafer.

Features
Enable to 8/12 inch wafer with semi-auto.
Providing wafer and taking out frame mount are by manual.

Specifications

  Max. work piece size
200〜300mm

  Tact
50sec/1 cycle

  Pressure method
Air cylinder

  Cut method
Round blade

  Device dimensions
(W)880×(D)720×(H)650mm

  Air supply
Dry air 0.5Mpa

  Power supply
AC100V

  Weight
120kg


   Dicing Tape Mount(Manual type)

MW-200/150
Dicing Tape Mount(Manual type)、MW-200/150

Purpose
To laminate dicing tape to Si wafer

Features
Compact manual type for 6/8 inch wafer.
Providing wafer flame, cutting tape, taking out of flame mount and laminating.

Specifications

  Max. work piece size
150〜200mm

  Film width
270mm

  Table temperature
Room temperature〜60℃

  Cut method
Round blade by manual

  Device dimensions
(W)430×(D)830×(H)250mm

  Air supply
Dry air 0.5Mpa

  Power supply
AC100V 1A

  Weight
20kg






* Company profile
Pioneer of Laminator MCK CO.,LTD