Products · Laminator
Three core laminator platforms, built around your process
Vacuum lamination for defect-free bonding, roll-to-roll dry film lamination for continuous production, and auto-cut lamination for sheet-fed HDI substrates.
Vacuum lamination for defect-free bonding, roll-to-roll dry film lamination for continuous production, and auto-cut lamination for sheet-fed HDI substrates.
From bubble-free vacuum lamination to continuous roll-to-roll production, every platform is engineered in-house — so you can choose the platform that best fits your material, application, and needs.
Bubble-free lamination in a vacuum chamber for uneven substrates and wafers.
Roll-to-roll dry film lamination for FPC and rigid-flex production.
Automatically cuts roll-form material to any size and laminates it, without a tacking step.
Our comprehensive range of laminators is designed to meet diverse production requirements, from high-volume FPCB manufacturing to precision HDI substrates. Each model can be customised to match specific customer requirements, ensuring optimal performance for your unique applications.
| Equipment Name | Roll to Roll Laminator | Auto-cut Laminator | Vacuum Laminator | Reduced Pressure Laminator |
|---|---|---|---|---|
| Model | FPC-DFW-500P | MFP-600 | MVR-500 | HLM-AV610N |
| Process | Roll To Roll | Roll to Sheet | Roll To Roll | Roll To Sheet |
| Effective Width/Size | Width 500mm | 250×250 to 610×610mm | Width 500mm | 200×200 to 610×610mm |
| Lamination Speed | MAX 6.0m/min | MAX 6.0m/min | MAX 6.0m/min | MAX 6.0m/min |
| Lamination Environment | Atmospheric | Atmospheric | Vacuum (50Pa) | Reduced Pressure (13.3kPa) |
| Film Cutting | — | Auto-cut method | — | Auto-cut method |
| Applications | Mass production FPCB, Rigid-Flex | Mass production HDI substrates | Mass production High-value substrate production | Mass production High-value substrate |
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