Wafer CSP Laminator

MN-812 / MN-8
Wafer CSP Laminator、MN-812/MN-8

Purpose
This machine is to laminate pre-cut dry film and functional film to wafer inside continuously with high precision.
(Available for wafer and other substrate)

Features
Enable to laminate with no tension so as not to load to work material.

Option
Enable to automatic heat laminate with adding heat device to roll and work table.

Specifications

  Effective width
200〜300mm

  Tact
1〜4piece / min

  Pressure method
Air cylinder

  Laminating precision
±0.1mm

  Device dimensions
(W)860×(D)690×(H)494mm

  Air supply
490kpa

  Power supply
AC100V

  Weight
100kg






* Company profile
Pioneer of Laminator MCK CO.,LTD