Purpose: Used for BGA/CSP printer head and HDD manufacturing.
Features: Delivers thin, double-ray flexible substrate with low brake tension, cuts photo resist film to an optional width, and laminates it with an automatic slit.
Option: Down-blow device with sensor.
Specifications
| Effective width | 60–160mm |
|---|---|
| Cleaning method | Adhesive rubber roll transcription method |
| Pressure application method | Air cylinder pressure |
| Film slit | One-touch set, upper & lower |
| Device dimensions | (W)1100 × (D)4000 × (H)1800mm |
| Air supply | 0.4Mpa or more |
| Power supply | 3-phase 200V |
| Weight | 3000kg |