Purpose: Tacks solder resist film to substrate before vacuum lamination, for electronics substrate production.
Features: Tacks film to substrate precisely and without wrinkles, after auto-cutting film to fit the work size.
Specifications
| Effective width | 300–600mm |
|---|---|
| Speed | 0–5.0m / min |
| Device dimensions | (W)1420 × (D)2120 × (H)1700mm |
| Air supply | Min. 0.4Mpa |
| Power supply | Φ3 AC200V |
| Weight | 850kg |