AUTO PRESS CUT LAMINATOR

MPA-150
Film Auto Cut Laminator for PDP、MPD-1000A

Purpose
In the process of semi-conductor packaging, enable to cut resist film and/or variou functional film then laminate to electronic substrate precisely.
Features
Enable to non-tention laminate without particle and bubble.Enable to laminate inside of substrate with equal temparatuer.Substrate and film can be delivered automatically.
Option
 

Specifications

  Effective width
(50〜150mm(Available for required size))

  Precision
(±0.2mm(Available±0.05mm subject to work set and optional device))

  Tact
20 second

  Device dimentions
W1775 X D850 X H1700mm

  Air supply
Min.0.5Mpa

  Power supply
3Φ200V 3kW 50/60Hz

  Weight
800kg






* Company profile
Pioneer of Laminator MCK CO.,LTD