Cover Lay Vacuum Laminator

MCV-250
カバーレイ真空ラミネーター、MCV-250型

Purpose
This machine is to laminate film by vacuum to 凸凹build up substrate, COF/FPC substrate and bonding for wafer without bubble.

Features
Enable to continuous laminating as roll to roll system with adding sending out/wind-up device.

Specifications

  Max. work piece size
300×300mm

  Vacuum performance
Max. 5hpa

  Available work piece thickness
50μm〜2mm

  Forming temperature
Room temperature〜150℃

  Device dimensions
(W)2900×(D)1500×(H)1500mm

  Air supply
Dry air 0.5Mpa

  Power supply
Φ3 AC200V 5.5KW

  Weight
2500kg






* Company profile
Pioneer of Laminator MCK CO.,LTD