Acquired ISO9001at Tokyo Factory
Cover Lay Vacuum Laminator
MCV-250
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| This machine is to laminate film by vacuum to �̱�build up
substrate, COF/FPC substrate and bonding for wafer without
bubble. |
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| Enable to continuous laminating as roll to roll system with adding sending out/wind-up device. |
Specifications
Max. work piece size
300��300mm
Vacuum performance
Max. 5hpa
Available work piece thickness
50��m��2mm
Forming temperature
Room temperature��150��
Device dimensions
��W��2900�ߡ�D��1500�ߡ�H��1500mm
Air supply
Dry air 0.5Mpa
Power supply
��3 AC200V 5.5KW
Weight
2500kg
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